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Semiconductor Device Modeling With Spice Book Pdf



Giuseppe Massobrio is a research associate in the department of electronic engineering (DIBE) at the University of Genova. He has done research in the areas of semiconductor device modeling as well as circuit simulation and optimization. He is the author of several papers on semiconductor device models for CAD applications. He is currently researching the development of semiconductor-based biosensor models for biomedical technologies.


Paolo Antognetti is a professor and chairman of the department of electronic engineering (DIBE) at the University of Genova. His extensive background in semiconductor modeling includes teaching and research positions at Stanford University and MIT. He has contributed to more than fifty papers in the field of electronics and VSLI design and simulation. He has edited several books, including Power Integrated Circuits: Physics, Design, and Applications, also published by McGraw-Hill.




Semiconductor Device Modeling with Spice book pdf



I started with the book recommended by the author of LTspice, which is Semiconductor Device Modeling with SPICE (2nd ed.) by Massobrio & Antognetti. At first, I felt completely overwhelmed by this book, but if you can just focus a bunch of time on Chapter 1 (diodes), then you'll find the later chapters are just building off that initial chapter. Maybe reread that chapter a couple times. The later chapters will cover actual parameter extraction techniques, but it's important to know what the parameters are doing first.


Several years later, I stumbled upon this next one which I think was very useful in its own right. It is called SPICE: Practical Device Modeling (1st ed.) by Kielkowski. However, it is a little outdated since it is focuses on SPICE2 while the most popular SPICE packages nowadays (except PSpice) are built off of SPICE3. You actually need to be aware of these little quirks if your intent is to make good models with wide compatibility. Think of PSPICE and SPICE3 to be two separate main branches off of SPICE2, while packages like LTspice and ngspice are little twigs hanging off of SPICE3.


  • More about this item Keywords device modeling; physics-based model; empirical modeling; TCAD device simulation; SPICE model; All these keywords.JEL classification: C60 - Mathematical and Quantitative Methods - - Mathematical Methods; Programming Models; Mathematical and Simulation Modeling - - - General

Statistics Access and download statistics Corrections All material on this site has been provided by the respective publishers and authors. You can help correct errors and omissions. When requesting a correction, please mention this item's handle: RePEc:ito:pchaps:210782. See general information about how to correct material in RePEc.


All Spice inqiries, except those for hardcopy documentation, should be directed to groups and persons affiliated with Spice. The Software Distribution Office now only facilitates the ordering of hardcopy documentation for this program.For SPICE3F4 MS-DOS Users:Call the Software Distribution Office to obtain the necessary instructionsto upgrade your diskettes: (510) 643-6687.SPICE is a general-purpose circuit simulatorwith several built-in semiconductor device models.SPICE performs several analyses, including nonlinear DC,nonlinear transient, and linear AC analysis.Device types includeresistors, capacitors, inductors, mutual inductors, switches,linear and nonlinear sources,lossy and lossless transmission lines,BJTs, JFETs, GaAs MESFETS, and MOSFETs.


SPICE3 is based directly on SPICE2.SPICE3F includes AC and DC sensitivity analysis, whichwas not available in the previous major release (3E).Also available are an enhancement to the JFET model,a correction to the continuity of the MOS3 model (with respect to thekappa parameter),table-format output for device operating-point data (like SPICE2),the ability to change individual device parameters or vector elementsinteractively,support for X11r5, hardcopy forPC graphics,memory leak fix for nonlinear sources,and many other bug fixes.Finally, the portability and installation procedures have beenimproved.SPICE3F3 contains numerous bug fixes over the previous minor release(SPICE3F2), notably in the AC sensitivity analysis, initial conditions,and plotting.


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